Sun, Zeyu, Yu, Shuyuan, Zhou, Han, Liu, Yibo, and Tan, Sheldon X.-D. EMSpice: Physics-Based Electromigration Check Using Coupled Electronic and Stress Simulation. Retrieved from https://par.nsf.gov/biblio/10195472. IEEE Transactions on Device and Materials Reliability 20.2 Web. doi:10.1109/TDMR.2020.2981628.

Sun, Zeyu, Yu, Shuyuan, Zhou, Han, Liu, Yibo, & Tan, Sheldon X.-D. EMSpice: Physics-Based Electromigration Check Using Coupled Electronic and Stress Simulation. IEEE Transactions on Device and Materials Reliability, 20 (2). Retrieved from https://par.nsf.gov/biblio/10195472. https://doi.org/10.1109/TDMR.2020.2981628

Sun, Zeyu, Yu, Shuyuan, Zhou, Han, Liu, Yibo, and Tan, Sheldon X.-D. "EMSpice: Physics-Based Electromigration Check Using Coupled Electronic and Stress Simulation". IEEE Transactions on Device and Materials Reliability 20 (2). Country unknown/Code not available. https://doi.org/10.1109/TDMR.2020.2981628. https://par.nsf.gov/biblio/10195472.

@article{osti_10195472,
place = {Country unknown/Code not available}, title = {EMSpice: Physics-Based Electromigration Check Using Coupled Electronic and Stress Simulation}, url = {https://par.nsf.gov/biblio/10195472}, DOI = {10.1109/TDMR.2020.2981628}, abstractNote = {}, journal = {IEEE Transactions on Device and Materials Reliability}, volume = {20}, number = {2}, author = {Sun, Zeyu and Yu, Shuyuan and Zhou, Han and Liu, Yibo and Tan, Sheldon X.-D.}, }