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Title: Molecular Dynamics Simulation of Poly Acrylic Acid as a Resist Material for Thermal Nanoimprint Lithography Processes
Nanoimprinting of polymers lays the foundation for several electronic and biomedical devices. Process parameter optimization have been conducted using thermal nanoimprint (T-NIL) experimentation. However, the underlying deformation mechanism of specific polymers under varying process condition needs further exploration. This research investigates the deformation behavior of poly acrylic acid (PAA) as a thermoplastic resist material for the T-NIL process. Molecular dynamics modeling was conducted on a PAA substrate imprinted with a rigid, spherical indenter. The effect of indenter size, force, and imprinting duration on the indentation depth, penetration depth, recovery depth, and recovery percentage of the polymer was evaluated. The results show that the largest indenter, regardless of force has the most significant impact on deformation behavior. The results of this research lay foundation for explaining the effect of several T-NIL process parameters on virgin PAA thermoplastic resist material.  more » « less
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Proceedings of the Industrial Engineers Research Conference 2020
Medium: X
Sponsoring Org:
National Science Foundation
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