Liu, Liu, Qu, Zheng, Deng, Lei, Tu, Fengbin, Li, Shuangchen, Hu, Xing, Gu, Zhenyu, Ding, Yufei, and Xie, Yuan. DUET: Boosting Deep Neural Network Efficiency on Dual-Module Architecture. Retrieved from https://par.nsf.gov/biblio/10203986. Proceedings Article published Oct 2020 in 2020 53rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO) . Web. doi:10.1109/MICRO50266.2020.00066.

Liu, Liu, Qu, Zheng, Deng, Lei, Tu, Fengbin, Li, Shuangchen, Hu, Xing, Gu, Zhenyu, Ding, Yufei, & Xie, Yuan. DUET: Boosting Deep Neural Network Efficiency on Dual-Module Architecture. Proceedings Article published Oct 2020 in 2020 53rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO), (). Retrieved from https://par.nsf.gov/biblio/10203986. https://doi.org/10.1109/MICRO50266.2020.00066

Liu, Liu, Qu, Zheng, Deng, Lei, Tu, Fengbin, Li, Shuangchen, Hu, Xing, Gu, Zhenyu, Ding, Yufei, and Xie, Yuan. "DUET: Boosting Deep Neural Network Efficiency on Dual-Module Architecture". Proceedings Article published Oct 2020 in 2020 53rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO) (). Country unknown/Code not available. https://doi.org/10.1109/MICRO50266.2020.00066. https://par.nsf.gov/biblio/10203986.

@article{osti_10203986,
place = {Country unknown/Code not available}, title = {DUET: Boosting Deep Neural Network Efficiency on Dual-Module Architecture}, url = {https://par.nsf.gov/biblio/10203986}, DOI = {10.1109/MICRO50266.2020.00066}, abstractNote = {}, journal = {Proceedings Article published Oct 2020 in 2020 53rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)}, author = {Liu, Liu and Qu, Zheng and Deng, Lei and Tu, Fengbin and Li, Shuangchen and Hu, Xing and Gu, Zhenyu and Ding, Yufei and Xie, Yuan}, editor = {null} }