Highly integrated, flexible, and ultrathin wireless communication components are in significant demand due to the explosive growth of portable and wearable electronic devices in the fifth‐generation (5G) network era, but only conventional metals meet the requirements for emerging radio‐frequency (RF) devices so far. Here, it is reported on Ti3C2T
- Award ID(s):
- 1422964
- NSF-PAR ID:
- 10226576
- Date Published:
- Journal Name:
- Science Advances
- Volume:
- 4
- Issue:
- 9
- ISSN:
- 2375-2548
- Page Range / eLocation ID:
- eaau0920
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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