Online Thermal Effect Modeling and Prediction of Implantable Devices
- Award ID(s):
- 1711447
- PAR ID:
- 10227991
- Date Published:
- Journal Name:
- IEEE Sensors Journal
- Volume:
- 21
- Issue:
- 3
- ISSN:
- 1530-437X
- Page Range / eLocation ID:
- 2443 to 2453
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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