An Effective and Accurate Data-Driven Approach for Thermal Simulation of CPUs
- Award ID(s):
- 2003307
- NSF-PAR ID:
- 10251975
- Date Published:
- Journal Name:
- ”, 2021 InterSociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2021)
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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