Xie, Di, Lyu, Zongyang, Fan, Mingyu, Chew, Huck Beng, Liaw, Peter K., Bei, Hongbin, Zhang, Zhongwu, and Gao, Yanfei. Micromechanical origin of the enhanced ductility in twinless duplex Mg–Li alloy. Retrieved from https://par.nsf.gov/biblio/10265853. Materials Science and Engineering: A 815.C Web. doi:10.1016/j.msea.2021.141305.
Xie, Di, Lyu, Zongyang, Fan, Mingyu, Chew, Huck Beng, Liaw, Peter K., Bei, Hongbin, Zhang, Zhongwu, and Gao, Yanfei.
"Micromechanical origin of the enhanced ductility in twinless duplex Mg–Li alloy". Materials Science and Engineering: A 815 (C). Country unknown/Code not available. https://doi.org/10.1016/j.msea.2021.141305.https://par.nsf.gov/biblio/10265853.
@article{osti_10265853,
place = {Country unknown/Code not available},
title = {Micromechanical origin of the enhanced ductility in twinless duplex Mg–Li alloy},
url = {https://par.nsf.gov/biblio/10265853},
DOI = {10.1016/j.msea.2021.141305},
abstractNote = {},
journal = {Materials Science and Engineering: A},
volume = {815},
number = {C},
author = {Xie, Di and Lyu, Zongyang and Fan, Mingyu and Chew, Huck Beng and Liaw, Peter K. and Bei, Hongbin and Zhang, Zhongwu and Gao, Yanfei},
editor = {null}
}
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