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Title: Thermal Conductivity of Aluminum Scandium Nitride for 5G Mobile Applications and Beyond
Authors:
; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ;
Award ID(s):
1841453 1841466
Publication Date:
NSF-PAR ID:
10274839
Journal Name:
ACS Applied Materials & Interfaces
Volume:
13
Issue:
16
Page Range or eLocation-ID:
19031 to 19041
ISSN:
1944-8244
Sponsoring Org:
National Science Foundation
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