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Title: Thermal Conductivity of Aluminum Scandium Nitride for 5G Mobile Applications and Beyond
Award ID(s):
1841453 1841466
NSF-PAR ID:
10274839
Author(s) / Creator(s):
; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ;
Date Published:
Journal Name:
ACS Applied Materials & Interfaces
Volume:
13
Issue:
16
ISSN:
1944-8244
Page Range / eLocation ID:
19031 to 19041
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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