Thermal Conductivity of Aluminum Scandium Nitride for 5G Mobile Applications and Beyond
- NSF-PAR ID:
- 10274839
- Date Published:
- Journal Name:
- ACS Applied Materials & Interfaces
- Volume:
- 13
- Issue:
- 16
- ISSN:
- 1944-8244
- Page Range / eLocation ID:
- 19031 to 19041
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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