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Nanoporous gold (np-Au) has found its use in applications ranging from catalysis to biosensing, where pore morphology plays a critical role in performance. While the morphology evolution of bulk np-Au has been widely studied, knowledge about its thin-film form is limited. This work hypothesizes that the mechanical compliance of the thin film substrate can play a critical role in the morphology evolution. Via experimental and finite-element-analysis approaches, we investigate the morphological variation in np-Au thin films deposited on compliant silicone (PDMS) substrates of a range of thicknesses anchored on rigid glass supports and compare those to the morphology of np-Au deposited on glass. More macroscopic (10 s to 100 s of microns) cracks and discrete islands form in the np-Au films on PDMS compared to on glass. Conversely, uniformly distributed microscopic (100 s of nanometers) cracks form in greater numbers in the np-Au films on glass than those on PDMS, with the cracks located within the discrete islands. The np-Au films on glass also show larger ligament and pore sizes, possibly due to higher residual stresses compared to the np-Au/PDMS films. The effective elastic modulus of the substrate layers decreases with increasing PDMS thickness, resulting in secondary np-Au morphology effects, including a reduction in macroscopic crack-to-crack distance, an increase in microscopic crack coverage, and a widening of the microscopic cracks. However, changes in the ligament/pore widths with PDMS thickness are negligible, allowing for independent optimization for cracking. We expect these results to inform the integration of functional np-Au films on compliant substrates into emerging applications, including flexible electronics.
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Failure Mechanisms of Lead Zirconate Titanate Thin Films during Electromechanical Loading
Understanding the failure mechanisms of piezoelectric thin films is critical for the commercialization of piezoelectric microelectromechanical systems. This paper describes the failure of 0.6 mu m lead zirconate titanate (PZT) thin films on Si wafers with different in-plane stresses under large electric fields. The films failed by a combination of cracking and thermal breakdown events. It was found that the crack initiation and propagation behavior varied with the stress state of the films. The total stress required for crack initiation was estimated to be near 500 MPa. As expected, cracks propagated perpendicular to the maximum tensile stress direction. Thermal breakdown events and cracks were correlated, suggesting coupling between electrical and mechanical failure. It was also found that films that were released from the underlying substrates were less susceptible to failure by cracking. It was proposed that during electric field loading the released film stacks were able to bow and alleviate some of the stress. Released films may also experience enhanced domain wall motion that increases their fracture toughness. The results indicate that both applied stress and clamping conditions play important roles in the electromechancial failure of piezoelectric thin films.
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- Award ID(s):
- 1841453
- PAR ID:
- 10274844
- Date Published:
- Journal Name:
- 2020 JOINT CONFERENCE OF THE IEEE INTERNATIONAL FREQUENCY CONTROL SYMPOSIUM AND INTERNATIONAL SYMPOSIUM ON APPLICATIONS OF FERROELECTRICS (IFCS-ISAF)
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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