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Title: Influence of Missing Linker Defects on the Thermal Conductivity of Metal–Organic Framework HKUST-1
Award ID(s):
1931436 1804011
NSF-PAR ID:
10300726
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
ACS Applied Materials & Interfaces
Volume:
12
Issue:
50
ISSN:
1944-8244
Page Range / eLocation ID:
56172 to 56177
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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