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  • Electrical Insulation Design and Accurate Estimation of Temperature via an Electrothermal Model for a 10 kV SiC Power Module Packaging
Title: Electrical Insulation Design and Accurate Estimation of Temperature via an Electrothermal Model for a 10 kV SiC Power Module Packaging
Award ID(s):
1942540
PAR ID:
10308698
Author(s) / Creator(s):
;
Date Published:
Journal Name:
IEEE Conference Electrical Insulation Dielectric Phenomena (CEIDP)
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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