Cheng, Li-Qian, Yan, Yongke, Li, Xiaotian, Xiong, Xiangming, Chen, Xin, Zhu, Li-Feng, Li, Wenjie, Chen, Kai, Sanghadasa, Mohan, and Priya, Shashank. Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress. Retrieved from https://par.nsf.gov/biblio/10308923. ACS Applied Materials & Interfaces 13.32 Web. doi:10.1021/acsami.1c09911.

Cheng, Li-Qian, Yan, Yongke, Li, Xiaotian, Xiong, Xiangming, Chen, Xin, Zhu, Li-Feng, Li, Wenjie, Chen, Kai, Sanghadasa, Mohan, & Priya, Shashank. Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress. ACS Applied Materials & Interfaces, 13 (32). Retrieved from https://par.nsf.gov/biblio/10308923. https://doi.org/10.1021/acsami.1c09911

Cheng, Li-Qian, Yan, Yongke, Li, Xiaotian, Xiong, Xiangming, Chen, Xin, Zhu, Li-Feng, Li, Wenjie, Chen, Kai, Sanghadasa, Mohan, and Priya, Shashank. "Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress". ACS Applied Materials & Interfaces 13 (32). Country unknown/Code not available. https://doi.org/10.1021/acsami.1c09911. https://par.nsf.gov/biblio/10308923.

@article{osti_10308923,
place = {Country unknown/Code not available}, title = {Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress}, url = {https://par.nsf.gov/biblio/10308923}, DOI = {10.1021/acsami.1c09911}, abstractNote = {}, journal = {ACS Applied Materials & Interfaces}, volume = {13}, number = {32}, author = {Cheng, Li-Qian and Yan, Yongke and Li, Xiaotian and Xiong, Xiangming and Chen, Xin and Zhu, Li-Feng and Li, Wenjie and Chen, Kai and Sanghadasa, Mohan and Priya, Shashank}, }