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Title: Thick AlN Templates By MOCVD for the Thermal Management of III-N Electronics
Award ID(s):
1810116 1711322
NSF-PAR ID:
10312821
Author(s) / Creator(s):
; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; more » ; « less
Date Published:
Journal Name:
ECS Meeting Abstracts
Volume:
MA2021-01
Issue:
33
ISSN:
2151-2043
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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