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Title: Thick AlN Templates By MOCVD for the Thermal Management of III-N Electronics
Authors:
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Award ID(s):
1810116 1711322
Publication Date:
NSF-PAR ID:
10312821
Journal Name:
ECS Meeting Abstracts
Volume:
MA2021-01
Issue:
33
ISSN:
2151-2043
Sponsoring Org:
National Science Foundation
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