Pu, Bo, He, Jiayi, Harmon, Aaron, Guo, Yuandong, Liu, Yuanzhuo, and Cai, Qiangming. Signal Integrity Design Methodology for Package in Co-packaged Optics Based on Figure of Merit as Channel Operating Margin. Retrieved from https://par.nsf.gov/biblio/10313038. 2021 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) . Web. doi:10.1109/EMC/SI/PI/EMCEurope52599.2021.9559168.

Pu, Bo, He, Jiayi, Harmon, Aaron, Guo, Yuandong, Liu, Yuanzhuo, & Cai, Qiangming. Signal Integrity Design Methodology for Package in Co-packaged Optics Based on Figure of Merit as Channel Operating Margin. 2021 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), (). Retrieved from https://par.nsf.gov/biblio/10313038. https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559168

Pu, Bo, He, Jiayi, Harmon, Aaron, Guo, Yuandong, Liu, Yuanzhuo, and Cai, Qiangming. "Signal Integrity Design Methodology for Package in Co-packaged Optics Based on Figure of Merit as Channel Operating Margin". 2021 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (). Country unknown/Code not available. https://doi.org/10.1109/EMC/SI/PI/EMCEurope52599.2021.9559168. https://par.nsf.gov/biblio/10313038.

@article{osti_10313038,
place = {Country unknown/Code not available}, title = {Signal Integrity Design Methodology for Package in Co-packaged Optics Based on Figure of Merit as Channel Operating Margin}, url = {https://par.nsf.gov/biblio/10313038}, DOI = {10.1109/EMC/SI/PI/EMCEurope52599.2021.9559168}, abstractNote = {}, journal = {2021 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)}, author = {Pu, Bo and He, Jiayi and Harmon, Aaron and Guo, Yuandong and Liu, Yuanzhuo and Cai, Qiangming}, }