Mitigating investment risk using modular technologies
- Award ID(s):
- 1748516
- NSF-PAR ID:
- 10319353
- Date Published:
- Journal Name:
- Computers & Chemical Engineering
- Volume:
- 153
- Issue:
- C
- ISSN:
- 0098-1354
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1016/j.compchemeng.2021.107424
