Miraz, Abu Shama, Meng, W.J., Ramachandran, Bala R., and Wick, Collin D.. Computational observation of the strengthening of Cu/TiN metal/ceramic interfaces by sub-nanometer interlayers and dopants. Retrieved from https://par.nsf.gov/biblio/10319524. Applied Surface Science 554.C Web. doi:10.1016/j.apsusc.2021.149562.

Miraz, Abu Shama, Meng, W.J., Ramachandran, Bala R., & Wick, Collin D.. Computational observation of the strengthening of Cu/TiN metal/ceramic interfaces by sub-nanometer interlayers and dopants. Applied Surface Science, 554 (C). Retrieved from https://par.nsf.gov/biblio/10319524. https://doi.org/10.1016/j.apsusc.2021.149562

Miraz, Abu Shama, Meng, W.J., Ramachandran, Bala R., and Wick, Collin D.. "Computational observation of the strengthening of Cu/TiN metal/ceramic interfaces by sub-nanometer interlayers and dopants". Applied Surface Science 554 (C). Country unknown/Code not available. https://doi.org/10.1016/j.apsusc.2021.149562. https://par.nsf.gov/biblio/10319524.

@article{osti_10319524,
place = {Country unknown/Code not available}, title = {Computational observation of the strengthening of Cu/TiN metal/ceramic interfaces by sub-nanometer interlayers and dopants}, url = {https://par.nsf.gov/biblio/10319524}, DOI = {10.1016/j.apsusc.2021.149562}, abstractNote = {}, journal = {Applied Surface Science}, volume = {554}, number = {C}, author = {Miraz, Abu Shama and Meng, W.J. and Ramachandran, Bala R. and Wick, Collin D.}, }