Shafe, Anwar, Wick, Collin D., Peters, Andrew J., Liu, Xiyuan, and Li, Guoqiang. Effect of atomistic fingerprints on thermomechanical properties of epoxy-diamine thermoset shape memory polymers. Retrieved from https://par.nsf.gov/biblio/10319527. Polymer 242.C Web. doi:10.1016/j.polymer.2022.124577.

Shafe, Anwar, Wick, Collin D., Peters, Andrew J., Liu, Xiyuan, & Li, Guoqiang. Effect of atomistic fingerprints on thermomechanical properties of epoxy-diamine thermoset shape memory polymers. Polymer, 242 (C). Retrieved from https://par.nsf.gov/biblio/10319527. https://doi.org/10.1016/j.polymer.2022.124577

Shafe, Anwar, Wick, Collin D., Peters, Andrew J., Liu, Xiyuan, and Li, Guoqiang. "Effect of atomistic fingerprints on thermomechanical properties of epoxy-diamine thermoset shape memory polymers". Polymer 242 (C). Country unknown/Code not available. https://doi.org/10.1016/j.polymer.2022.124577. https://par.nsf.gov/biblio/10319527.

@article{osti_10319527,
place = {Country unknown/Code not available}, title = {Effect of atomistic fingerprints on thermomechanical properties of epoxy-diamine thermoset shape memory polymers}, url = {https://par.nsf.gov/biblio/10319527}, DOI = {10.1016/j.polymer.2022.124577}, abstractNote = {}, journal = {Polymer}, volume = {242}, number = {C}, author = {Shafe, Anwar and Wick, Collin D. and Peters, Andrew J. and Liu, Xiyuan and Li, Guoqiang}, }