skip to main content
US FlagAn official website of the United States government
dot gov icon
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
https lock icon
Secure .gov websites use HTTPS
A lock ( lock ) or https:// means you've safely connected to the .gov website. Share sensitive information only on official, secure websites.

Explore Research Products in the PAR
It may take a few hours for recently added research products to appear in PAR search results.


Title: (Invited) Silicon Nanosheets as Candidates for Silicon-Based Optoelectronics
The growth in computational ability over the past decades has positively impacted global development, the economy, healthcare, and science. As on-chip components are approaching the atomic scale, alternative paradigms are needed to address the thermal and electronic issues that impose bottlenecks for computing. One approach to address this is with optoelectronics. However, silicon—the backbone of microelectronics—is a poor choice due to its indirect bandgap, while existing optoelectronic materials are incompatible with CMOS infrastructure. Monolayer silicon nanosheets (SiNSs) are an intriguing material that exhibit photoluminescence, and are compositionally-compatible with the CMOS process. Here, we synthesize and characterize monolayer SiNSs, and show spectroscopic evidence that they exhibit a quasi-direct bandgap, which is corroborated by DFT calculations. We probe their thermal stability, demonstrating their structure and photoluminescence are stable beyond the required operating temperatures for computing applications. These optoelectronic properties, CMOS-compatibility, and stability make SiNSs a viable candidate for silicon-based photonics.  more » « less
Award ID(s):
1847370
PAR ID:
10321768
Author(s) / Creator(s):
; ; ; ; ; ;
Date Published:
Journal Name:
ECS Transactions
Volume:
102
Issue:
1
ISSN:
1938-5862
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
More Like this
  1. ; ; ; ; (, Nanoscale)
    Lateral multiheterostructures with spatially modulated bandgaps have great potential for applications in high-performance electronic, optoelectronic and thermoelectric devices. Multiheterostructures based on transition metal tellurides are especially promising due to their tunable bandgap in a wide range and the rich variety of structural phases. However, the synthesis of telluride-based multiheterostructures remains a challenge due to the low activity of tellurium and the poor thermal stability of tellurium alloys. In this work, we synthesized monolayer WSe 2−2 x Te 2 x /WSe 2−2 y Te 2 y ( x > y ) multiheterostructures in situ using chemical vapor deposition (CVD). Photoluminescence analysis and Raman mapping confirm the spatial modulation of the bandgap in the radial direction. Furthermore, field-effect transistors with the channels parallel (type I) and perpendicular (type II) to the multiheterostructure rings were fabricated. Type I transistors exhibit enhanced ambipolar transport, due to the low energy bridges between the source and drain. Remarkably, the photocurrents in type I transistors are two orders of magnitude higher than those in type II transistors, which can be attributed to the fact that the photovoltaic photocurrents generated at the two heterojunctions are summed together in type I transistors, but they cancel each other in type II transistors. These multiheterostructures will provide a new platform for novel electronic/photonic devices with potential applications in broadband light sensing, highly sensitive imaging and ultrafast optoelectronic integrated circuits. 
    more » « less
  2. ; ; (, Nanomaterials)
    We report on the use of 2D Ruddlesden–Popper (RP) perovskites as optoelectronic materials in building-integrated applications, addressing the challenge of balancing transparency, photoluminescence, and stability. With the addition of polyvinylpyrrolidone (PVP), the 2D RP films exhibit superior transparency compared to their 3D counterparts with an average visible transmittance (AVT) greater than 50% and photoluminescence stability under continuous illumination and 85 °C heat for up to 100 h as bare, unencapsulated films. Structural investigations show a stress relaxation in the 3D perovskite films after degradation from thermal aging that is not observed in the 2D RP films, which retain their phase after thermal and light aging. We also demonstrate ultrasmooth, wide-bandgap 2D Dion–Jacobson (DJ) films with PVP incorporation up to 2.95 eV, an AVT above 70%, and roughnesses of ~2 nm. These findings contribute to the development of next-generation solar materials, paving the way for their integration into built structures. 
    more » « less
  3. ; (, Micromachines)
    Low-dimension materials such as transition metal dichalcogenides (TMDCs) have received extensive research interest and investigation for electronic and optoelectronic applications. Due to their unique widely tunable band structures, they are good candidates for next-generation optoelectronic devices. Particularly, their photoluminescence properties, which are fundamental for optoelectronic applications, are highly sensitive to the nature of the band gap. Monolayer TMDCs in the room temperature range have presented a direct band gap behavior and bright photoluminescence. In this work, we investigate a popular TMDC material WSe2’s photoluminescence performance using a Raman spectroscopy laser with temperature dependence. With temperature variation, the lattice constant and the band gap change dramatically, and thus the photoluminescence spectra are changed. By checking the photoluminescence spectra at different temperatures, we are able to reveal the nature of direct-to-indirect band gap in monolayer WSe2. We also implemented density function theory (DFT) simulations to computationally investigate the band gap of WSe2 to provide comprehensive evidence and confirm the experimental results. Our study suggests that monolayer WSe2 is at the transition boundary between the indirect and direct band gap at room temperature. This result provides insights into temperature-dependent optical transition in monolayer WSe2 for quantum control, and is important for cultivating the potential of monolayer WSe2 in thermally tunable optoelectronic devices operating at room temperature. 
    more » « less
  4. ; ; ; ; ; ; ; ; ; ; et al (, Advanced Optical Materials)
    Abstract Silicon carbide (SiC)'s nonlinear optical properties and applications to quantum information have recently brought attention to its potential as an integrated photonics platform. However, despite its many excellent material properties, such as large thermal conductivity, wide transparency window, and strong optical nonlinearities, it is generally a difficult material for microfabrication. Here, it is shown that directly bonded silicon‐on‐silicon carbide can be a high‐performing hybrid photonics platform that does not require the need to form SiC membranes or directly pattern in SiC. The optimized bonding method yields defect‐free, uniform films with minimal oxide at the silicon–silicon–carbide interface. Ring resonators are patterned into the silicon layer with standard, complimentary metal–oxide–semiconductor (CMOS) compatible (Si) fabrication and measure room‐temperature, near‐infrared quality factors exceeding 105. The corresponding propagation loss is 5.7 dB cm−1. The process offers a wafer‐scalable pathway to the integration of SiC photonics into CMOS devices. 
    more » « less
  5. ; ; ; (, Proceedings Volume 12020, Vertical-Cavity Surface-Emitting Lasers XXVI)
    Choquette, Kent D.; Lei, Chun; Graham, Luke A. (Ed.)
    A wafer-scale CMOS-compatible process for heterogeneous integration of III-V epitaxial material onto silicon for photonic device fabrication is presented. Transfer of AlGaAs-GaAs Vertical-Cavity Surface-Emitting Laser (VCSEL) epitaxial material onto silicon using a carrier wafer process and metallic bonding is used to form III-V islands which are subsequently processed into VCSELs. The transfer process begins with the bonding of III-V wafer pieces epitaxy-down on a carrier wafer using a temporary bonding material. Following substrate removal, precisely-located islands of material are formed using photolithography and dry etching. These islands are bonded onto a silicon host wafer using a thin-film non-gold metal bonding process and the transfer wafer is removed. Following the bonding of the epitaxial islands onto the silicon wafer, standard processing methods are used to form VCSELs with non-gold contacts. The removal of the GaAs substrate prior to bonding provides an improved thermal pathway which leads to a reduction in wavelength shift with output power under continuous-wave (CW) excitation. Unlike prior work in which fullyfabricated VCSELs are flip-chip bonded to silicon, all photonic device processing takes place after the epitaxial transfer process. The electrical and optical performance of heterogeneously integrated 850nm GaAs VCSELs on silicon is compared to their as-grown counterparts. The demonstrated method creates the potential for the integration of III-V photonic devices with silicon CMOS, including CMOS imaging arrays. Such devices could have use in applications ranging from 3D imaging to LiDAR. 
    more » « less
  • Citation Formats
  • MLA
  • APA
  • Chicago
  • BibTeX
  • Save / Share this Record
  • Send to Email