Lee, Jihyeon, He, Siqin, Song, Guanyu, and Hogan, Christopher J. Size distribution monitoring for chemical mechanical polishing slurries: An intercomparison of electron microscopy, dynamic light scattering, and differential mobility analysis. Retrieved from https://par.nsf.gov/biblio/10324205. Powder Technology 396.PA Web. doi:10.1016/j.powtec.2021.10.045.

Lee, Jihyeon, He, Siqin, Song, Guanyu, & Hogan, Christopher J. Size distribution monitoring for chemical mechanical polishing slurries: An intercomparison of electron microscopy, dynamic light scattering, and differential mobility analysis. Powder Technology, 396 (PA). Retrieved from https://par.nsf.gov/biblio/10324205. https://doi.org/10.1016/j.powtec.2021.10.045

Lee, Jihyeon, He, Siqin, Song, Guanyu, and Hogan, Christopher J. "Size distribution monitoring for chemical mechanical polishing slurries: An intercomparison of electron microscopy, dynamic light scattering, and differential mobility analysis". Powder Technology 396 (PA). Country unknown/Code not available. https://doi.org/10.1016/j.powtec.2021.10.045. https://par.nsf.gov/biblio/10324205.

@article{osti_10324205,
place = {Country unknown/Code not available}, title = {Size distribution monitoring for chemical mechanical polishing slurries: An intercomparison of electron microscopy, dynamic light scattering, and differential mobility analysis}, url = {https://par.nsf.gov/biblio/10324205}, DOI = {10.1016/j.powtec.2021.10.045}, abstractNote = {}, journal = {Powder Technology}, volume = {396}, number = {PA}, author = {Lee, Jihyeon and He, Siqin and Song, Guanyu and Hogan, Christopher J.}, }