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Title: Anisotropic Wet Etching of Si as a Fabrication Tool Enabling 3-D Microphotonics Structures and Devices
Authors:
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Award ID(s):
2052745
Publication Date:
NSF-PAR ID:
10331024
Journal Name:
NAECON 2021 - IEEE National Aerospace and Electronics Conference
Page Range or eLocation-ID:
146 to 149
Sponsoring Org:
National Science Foundation
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