Anisotropic Wet Etching of Si as a Fabrication Tool Enabling 3-D Microphotonics Structures and Devices
- Award ID(s):
- 2052745
- Publication Date:
- NSF-PAR ID:
- 10331024
- Journal Name:
- NAECON 2021 - IEEE National Aerospace and Electronics Conference
- Page Range or eLocation-ID:
- 146 to 149
- Sponsoring Org:
- National Science Foundation
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