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Title: A methodology for thermal simulation of interconnects enabled by model reduction with material property variation
Award ID(s):
2003307
PAR ID:
10336168
Author(s) / Creator(s):
;
Date Published:
Journal Name:
Journal of Computational Science
Volume:
61
Issue:
C
ISSN:
1877-7503
Page Range / eLocation ID:
101665
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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