A methodology for thermal simulation of interconnects enabled by model reduction with material property variation
- Award ID(s):
- 2003307
- PAR ID:
- 10336168
- Date Published:
- Journal Name:
- Journal of Computational Science
- Volume:
- 61
- Issue:
- C
- ISSN:
- 1877-7503
- Page Range / eLocation ID:
- 101665
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1016/j.jocs.2022.101665
