Multi-Element Thermal Modeling of Interconnects Derived from a Projection-based Leaning Algorithm
- Award ID(s):
- 2003307
- PAR ID:
- 10336175
- Date Published:
- Journal Name:
- International Conference Simulation of Semicond. Processes and Devices
- Page Range / eLocation ID:
- 73 to 76
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Conference Paper:
- https://doi.org/10.1109/SISPAD54002.2021.9592588
