Rangarajan, Srikanth, Choobineh, Leila, and Sammakia, Bahgat. Supervised Machine-Learning Approach for the Optimal Arrangement of Active Hotspots in 3-D Integrated Circuits. Retrieved from https://par.nsf.gov/biblio/10338978. IEEE Transactions on Components, Packaging and Manufacturing Technology 11.10 Web. doi:10.1109/TCPMT.2021.3109662.

Rangarajan, Srikanth, Choobineh, Leila, & Sammakia, Bahgat. Supervised Machine-Learning Approach for the Optimal Arrangement of Active Hotspots in 3-D Integrated Circuits. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (10). Retrieved from https://par.nsf.gov/biblio/10338978. https://doi.org/10.1109/TCPMT.2021.3109662

Rangarajan, Srikanth, Choobineh, Leila, and Sammakia, Bahgat. "Supervised Machine-Learning Approach for the Optimal Arrangement of Active Hotspots in 3-D Integrated Circuits". IEEE Transactions on Components, Packaging and Manufacturing Technology 11 (10). Country unknown/Code not available. https://doi.org/10.1109/TCPMT.2021.3109662. https://par.nsf.gov/biblio/10338978.

@article{osti_10338978,
place = {Country unknown/Code not available}, title = {Supervised Machine-Learning Approach for the Optimal Arrangement of Active Hotspots in 3-D Integrated Circuits}, url = {https://par.nsf.gov/biblio/10338978}, DOI = {10.1109/TCPMT.2021.3109662}, abstractNote = {}, journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology}, volume = {11}, number = {10}, author = {Rangarajan, Srikanth and Choobineh, Leila and Sammakia, Bahgat}, }