Ren, Guangyu, Huang, Lili, Hu, Kunling, Li, Tianxin, Lu, Yiping, Qiao, Dongxu, Zhang, Haitao, Xu, Dake, Wang, Tongmin, Li, Tingju, and Liaw, Peter K. Enhanced antibacterial behavior of a novel Cu-bearing high-entropy alloy. Retrieved from https://par.nsf.gov/biblio/10343694. Journal of Materials Science & Technology 117.C Web. doi:10.1016/j.jmst.2022.02.001.

Ren, Guangyu, Huang, Lili, Hu, Kunling, Li, Tianxin, Lu, Yiping, Qiao, Dongxu, Zhang, Haitao, Xu, Dake, Wang, Tongmin, Li, Tingju, & Liaw, Peter K. Enhanced antibacterial behavior of a novel Cu-bearing high-entropy alloy. Journal of Materials Science & Technology, 117 (C). Retrieved from https://par.nsf.gov/biblio/10343694. https://doi.org/10.1016/j.jmst.2022.02.001

Ren, Guangyu, Huang, Lili, Hu, Kunling, Li, Tianxin, Lu, Yiping, Qiao, Dongxu, Zhang, Haitao, Xu, Dake, Wang, Tongmin, Li, Tingju, and Liaw, Peter K. "Enhanced antibacterial behavior of a novel Cu-bearing high-entropy alloy". Journal of Materials Science & Technology 117 (C). Country unknown/Code not available. https://doi.org/10.1016/j.jmst.2022.02.001. https://par.nsf.gov/biblio/10343694.

@article{osti_10343694,
place = {Country unknown/Code not available}, title = {Enhanced antibacterial behavior of a novel Cu-bearing high-entropy alloy}, url = {https://par.nsf.gov/biblio/10343694}, DOI = {10.1016/j.jmst.2022.02.001}, abstractNote = {}, journal = {Journal of Materials Science & Technology}, volume = {117}, number = {C}, author = {Ren, Guangyu and Huang, Lili and Hu, Kunling and Li, Tianxin and Lu, Yiping and Qiao, Dongxu and Zhang, Haitao and Xu, Dake and Wang, Tongmin and Li, Tingju and Liaw, Peter K.}, }