Materials and Device Strategies for Nanoelectronic 3D Heterogeneous Integration
- Award ID(s):
- 1917025
- PAR ID:
- 10351444
- Date Published:
- Journal Name:
- IEEE International Conference on Simulation of Semiconductor Processes and Devices
- Page Range / eLocation ID:
- 163 to 166
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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