Cenhrang, Khamhbawihum, Robart, Logan, Castiaux, Andre D., and Martin, R. Scott. 3D printed devices with integrated collagen scaffolds for cell culture studies including transepithelial/transendothelial electrical resistance (TEER) measurements. Retrieved from https://par.nsf.gov/biblio/10353650. Analytica Chimica Acta 1221.C Web. doi:10.1016/j.aca.2022.340166.

Cenhrang, Khamhbawihum, Robart, Logan, Castiaux, Andre D., & Martin, R. Scott. 3D printed devices with integrated collagen scaffolds for cell culture studies including transepithelial/transendothelial electrical resistance (TEER) measurements. Analytica Chimica Acta, 1221 (C). Retrieved from https://par.nsf.gov/biblio/10353650. https://doi.org/10.1016/j.aca.2022.340166

Cenhrang, Khamhbawihum, Robart, Logan, Castiaux, Andre D., and Martin, R. Scott. "3D printed devices with integrated collagen scaffolds for cell culture studies including transepithelial/transendothelial electrical resistance (TEER) measurements". Analytica Chimica Acta 1221 (C). Country unknown/Code not available. https://doi.org/10.1016/j.aca.2022.340166. https://par.nsf.gov/biblio/10353650.

@article{osti_10353650,
place = {Country unknown/Code not available}, title = {3D printed devices with integrated collagen scaffolds for cell culture studies including transepithelial/transendothelial electrical resistance (TEER) measurements}, url = {https://par.nsf.gov/biblio/10353650}, DOI = {10.1016/j.aca.2022.340166}, abstractNote = {}, journal = {Analytica Chimica Acta}, volume = {1221}, number = {C}, author = {Cenhrang, Khamhbawihum and Robart, Logan and Castiaux, Andre D. and Martin, R. Scott}, }