Irradiation induced void spheroidization, shrinkage and migration in Cu at elevated temperatures: An in situ study
- Award ID(s):
- 1728419
- NSF-PAR ID:
- 10359181
- Date Published:
- Journal Name:
- Acta Materialia
- Volume:
- 201
- Issue:
- C
- ISSN:
- 1359-6454
- Page Range / eLocation ID:
- 504 to 516
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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