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Title: Irradiation induced void spheroidization, shrinkage and migration in Cu at elevated temperatures: An in situ study
Authors:
; ; ; ; ; ; ;
Award ID(s):
1728419
Publication Date:
NSF-PAR ID:
10359181
Journal Name:
Acta Materialia
Volume:
201
Issue:
C
Page Range or eLocation-ID:
504 to 516
ISSN:
1359-6454
Sponsoring Org:
National Science Foundation
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