The metallic tin (Sn) anode is a promising candidate for next‐generation lithium‐ion batteries (LIBs) due to its high theoretical capacity and electrical conductivity. However, Sn suffers from severe mechanical degradation caused by large volume changes during lithiation/delithiation, which leads to a rapid capacity decay for LIBs application. Herein, a Cu–Sn (e.g., Cu3Sn) intermetallic coating layer (ICL) is rationally designed to stabilize Sn through a structural reconstruction mechanism. The low activity of the Cu–Sn ICL against lithiation/delithiation enables the gradual separation of the metallic Cu phase from the Cu–Sn ICL, which provides a regulatable and appropriate distribution of Cu to buffer volume change of Sn anode. Concurrently, the homogeneous distribution of the separated Sn together with Cu promotes uniform lithiation/delithiation, mitigating the internal stress. In addition, the residual rigid Cu–Sn intermetallic shows terrific mechanical integrity that resists the plastic deformation during the lithiation/delithiation. As a result, the Sn anode enhanced by the Cu–Sn ICL shows a significant improvement in cycling stability with a dramatically reduced capacity decay rate of 0.03% per cycle for 1000 cycles. The structural reconstruction mechanism in this work shines a light on new materials and structural design that can stabilize high‐performance and high‐volume‐change electrodes for rechargeable batteries and beyond.
Computational methods are increasingly being incorporated into the exploitation of microstructure–property relationships for microstructure-sensitive design of materials. In the present work, we propose non-intrusive materials informatics methods for the high-throughput exploration and analysis of a synthetic microstructure space using a machine learning-reinforced multi-phase-field modeling scheme. We specifically study the interface energy space as one of the most uncertain inputs in phase-field modeling and its impact on the shape and contact angle of a growing phase during heterogeneous solidification of secondary phase between solid and liquid phases. We evaluate and discuss methods for the study of sensitivity and propagation of uncertainty in these input parameters as reflected on the shape of the Cu6Sn5intermetallic during growth over the Cu substrate inside the liquid Sn solder due to uncertain interface energies. The sensitivity results rank
- Award ID(s):
- 2001333
- PAR ID:
- 10361289
- Publisher / Repository:
- Springer Science + Business Media
- Date Published:
- Journal Name:
- Materials Theory
- Volume:
- 6
- Issue:
- 1
- ISSN:
- 2509-8012
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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Clathrates of Tetrel elements (Si, Ge, Sn) have attracted interest for their potential use in batteries and other applications. Sodium-filled silicon clathrates are conventionally synthesized through thermal decomposition of the Zintl precursor Na4Si4, but phase selectivity of the product is often difficult to achieve. Herein, we report the selective formation of the type I clathrate Na8Si46using electrochemical oxidation at 450 °C and 550 °C. A two-electrode cell design inspired by high-temperature sodium-sulfur batteries is employed, using Na4Si4as working electrode, Na
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