Polymorphic Control of Solution-Processed Cu 2 SnS 3 Films with Thiol–Amine Ink Formulation
- NSF-PAR ID:
- 10373590
- Publisher / Repository:
- American Chemical Society
- Date Published:
- Journal Name:
- Chemistry of Materials
- Volume:
- 34
- Issue:
- 19
- ISSN:
- 0897-4756
- Page Range / eLocation ID:
- p. 8654-8663
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation