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Title: Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint During Aging
Award ID(s):
1763128
PAR ID:
10383506
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
Journal of Electronic Materials
Volume:
50
Issue:
12
ISSN:
0361-5235
Page Range / eLocation ID:
6607 to 6614
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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