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Title: Fast electromigration stress analysis considering spatial Joule heating effects
In this paper, we propose a new spatial temperature aware transient EM induced stress analysis method. The new method consists of two new contributions: First, we propose a new TM-aware void saturation volume estimation method for fast immortality check in the post-voiding phase for the first time. We derive the analytic formula to estimate the void saturation in the presence of spatial temperature gradients due to Joule heating. Second, we developed a fast numerical solution for EM-induced stress analysis for multi-segment interconnect trees considering TM effect. The new method first transforms the coupled EM-TM partial differential equations into linear time-invariant ordinary differential equations (ODEs). Then extended Krylov subspace-based reduction technique is employed to reduce the size of the original system matrices so that they can be efficiently simulated in the time domain. The proposed method can perform the simulation process for both void nucleation and void growth phases under time-varying input currents and position-dependent temperatures. The numerical results show that, compared to the recently proposed semi-analytic EM-TM method, the proposed method can lead to about 28x speedup on average for the interconnect with up to 1000 branches for both void nucleation and growth phases with negligible errors.  more » « less
Award ID(s):
2007135
NSF-PAR ID:
10393260
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
Proc. Asia South Pacific Design Automation Conference (ASP-DAC’22),
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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