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Title: EM-GAN: Data-driven fast stress analysis for multi-segment interconnects
Electromigration (EM) analysis for complicated interconnects requires the solving of partial differential equations, which is expensive. In this paper, we propose a fast transient hydrostatic stress analysis for EM failure assessment for multi-segment interconnects using generative adversarial networks (GANs). Our work is inspired by the image synthesis and feature of generative deep neural networks. The stress evaluation of multi-segment interconnects, modeled by partial differential equations, can be viewed as time-varying 2D-images-to-image problem where the input is the multi-segment interconnects topology with current densities and the output is the EM stress distribution in those wire segments at the given aging time. We show that the conditional GAN can be exploited to attend the temporal dynamics for modeling the time-varying dynamic systems like stress evolution over time. The resulting algorithm, called {\it EM-GAN}, can quickly give accurate stress distribution of a general multi-segment wire tree for a given aging time, which is important for full-chip fast EM failure assessment. Our experimental results show that the EM-GAN shows 6.6\% averaged error compared to COMSOL simulation results with orders of magnitude speedup. It also delivers $8.3 \times$ speedup over state-of-the-art analytic based EM analysis solver.  more » « less
Award ID(s):
1816361 2007135
Author(s) / Creator(s):
; ; ; ;
Date Published:
Journal Name:
Proc. IEEE Int. Conf. on Computer Design (ICCD),
Medium: X
Sponsoring Org:
National Science Foundation
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