Title: Optimizing the Placement of Non-Functional Pads on Signal Vias Using Multiple Reflection Analysis
Award ID(s):
1916535
PAR ID:
10393345
Author(s) / Creator(s):
; ; ; ; ; ; ;
Date Published:
Journal Name:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
Page Range / eLocation ID:
169 to 174
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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