Xia, Shengxuan, Olugbade, Emmanuel, He, Yuchu, Wang, Yansheng, Wang, Hanfeng, Rao, Krishna, Poort, Marco, Zhou, Haicheng, Lee, Warren, McDonnell, Nicholas, Park, Jonghyun, and Hwang, Chulsoon. Passive Intermodulation Under Different Spring Contact Conditions. Retrieved from https://par.nsf.gov/biblio/10393534. 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) . Web. doi:10.1109/EMCSI39492.2022.9889661.

Xia, Shengxuan, Olugbade, Emmanuel, He, Yuchu, Wang, Yansheng, Wang, Hanfeng, Rao, Krishna, Poort, Marco, Zhou, Haicheng, Lee, Warren, McDonnell, Nicholas, Park, Jonghyun, & Hwang, Chulsoon. Passive Intermodulation Under Different Spring Contact Conditions. 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), (). Retrieved from https://par.nsf.gov/biblio/10393534. https://doi.org/10.1109/EMCSI39492.2022.9889661

Xia, Shengxuan, Olugbade, Emmanuel, He, Yuchu, Wang, Yansheng, Wang, Hanfeng, Rao, Krishna, Poort, Marco, Zhou, Haicheng, Lee, Warren, McDonnell, Nicholas, Park, Jonghyun, and Hwang, Chulsoon. "Passive Intermodulation Under Different Spring Contact Conditions". 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (). Country unknown/Code not available. https://doi.org/10.1109/EMCSI39492.2022.9889661. https://par.nsf.gov/biblio/10393534.

@article{osti_10393534,
place = {Country unknown/Code not available}, title = {Passive Intermodulation Under Different Spring Contact Conditions}, url = {https://par.nsf.gov/biblio/10393534}, DOI = {10.1109/EMCSI39492.2022.9889661}, abstractNote = {}, journal = {2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)}, author = {Xia, Shengxuan and Olugbade, Emmanuel and He, Yuchu and Wang, Yansheng and Wang, Hanfeng and Rao, Krishna and Poort, Marco and Zhou, Haicheng and Lee, Warren and McDonnell, Nicholas and Park, Jonghyun and Hwang, Chulsoon}, }