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Title: Fiber-Array-to-Chip Interconnections With Sub-Micron Placement Accuracy via Self-Aligning Chiplets
Award ID(s):
1915971
PAR ID:
10396380
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
IEEE Photonics Technology Letters
Volume:
34
Issue:
19
ISSN:
1041-1135
Page Range / eLocation ID:
1023 to 1025
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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