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Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.
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Fabrication of Cu-CNT Composite and Cu Using Laser Powder Bed Fusion Additive Manufacturing
Additive manufacturing (AM) as a disruptive technique has offered great potential to design and fabricate many metallic components for aerospace, medical, nuclear, and energy applications where parts have complex geometry. However, a limited number of materials suitable for the AM process is one of the shortcomings of this technique, in particular laser AM of copper (Cu) is challenging due to its high thermal conductivity and optical reflectivity, which requires higher heat input to melt powders. Fabrication of composites using AM is also very challenging and not easily achievable using the current powder bed technologies. Here, the feasibility to fabricate pure copper and copper-carbon nanotube (Cu-CNT) composites was investigated using laser powder bed fusion additive manufacturing (LPBF-AM), and 10 × 10 × 10 mm3 cubes of Cu and Cu-CNTs were made by applying a Design of Experiment (DoE) varying three parameters: laser power, laser speed, and hatch spacing at three levels. For both Cu and Cu-CNT samples, relative density above 90% and 80% were achieved, respectively. Density measurement was carried out three times for each sample, and the error was found to be less than 0.1%. Roughness measurement was performed on a 5 mm length of the sample to obtain statistically significant results. As-built Cu showed average surface roughness (Ra) below 20 µm; however, the surface of AM Cu-CNT samples showed roughness values as large as 1 mm. Due to its porous structure, the as-built Cu showed thermal conductivity of ~108 W/m·K and electrical conductivity of ~20% IACS (International Annealed Copper Standard) at room temperature, ~70% and ~80% lower than those of conventionally fabricated bulk Cu. Thermal conductivity and electrical conductivity were ~85 W/m·K and ~10% IACS for as-built Cu-CNT composites at room temperature. As-built Cu-CNTs showed higher thermal conductivity as compared to as-built Cu at a temperature range from 373 K to 873 K. Because of their large surface area, light weight, and large energy absorbing behavior, porous Cu and Cu-CNT materials can be used in electrodes, catalysts and their carriers, capacitors, heat exchangers, and heat and impact absorption.
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- Award ID(s):
- 2152254
- PAR ID:
- 10412920
- Date Published:
- Journal Name:
- Powders
- Volume:
- 1
- Issue:
- 4
- ISSN:
- 2674-0516
- Page Range / eLocation ID:
- 207 to 220
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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This study investigated the impact of low-temperature heat treatments on the mechanical and thermophysical properties of Cu-10Sn alloys fabricated by a laser powder bed fusion (LPBF) additive manufacturing (AM) process. The microstructure, phase structure, and mechanical and thermal properties of the LPBF Cu-10Sn samples were comparatively investigated under both the as-fabricated (AF) condition and after low-temperature heat treatments at 140, 180, 220, 260, and 300 °C. The results showed that the low-temperature heat treatments did not significantly affect the phase and grain structures of the Cu-10Sn alloys. Both pre- and post-treatment samples displayed consistent grain sizes, with no obvious X-ray diffraction angle shift for the α phase, indicating that atom diffusion of the Sn element is beyond the detection resolution of X-ray diffractometers (XRD). However, the 180 °C heat-treated sample exhibited the highest hardness, while the AF samples had the lowest hardness, which was most likely due to the generation of precipitates according to thermodynamics modeling. Heat-treated samples also displayed higher thermal diffusivity values than their AF counterpart. The AF sample had the longest lifetime of ~0.19 nanoseconds (ns) in the positron annihilation lifetime spectroscopy (PALS) test, indicating the presence of the most atomic-level defects.more » « less
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Abstract Current Additive Manufacturing (AM) technologies are typically limited by the minimum feature sizes of the parts they can produce. This issue is addressed by the microscale selective laser sintering system (µ-SLS), which is capable of building parts with single micrometer resolutions. Despite the resolution of the system, the minimum feature sizes producible using the µ-SLS tool are limited by unwanted heat dissipation through the particle bed during the sintering process. To address this unwanted heat flow, a particle scale thermal model is needed to characterize the thermal conductivity of the nanoparticle bed during sintering and facilitate the prediction of heat affected zones (HAZ). This would allow for the optimization of process parameters and a reduction in error for the final part. This paper presents a method for the determination of the effective thermal conductivity of copper nanoparticle beds in a µ-SLS system using finite element simulations performed in ANSYS. A Phase Field Model (PFM) is used to track the geometric evolution of the particle groups within the particle bed during sintering. CAD models are extracted from the PFM output data at various timesteps, and steady state thermal simulations are performed on each particle group. The full simulation developed in this work is scalable to particle groups with variable sizes and geometric arrangements. The particle thermal model results from this work are used to calculate the thermal conductivity of the copper nanoparticles as a function of the density of the particle group.more » « less
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Laser powder bed fusion (PBF‐LB) is an additive manufacturing (AM) technology for producing complex geometry parts. However, the high cost of post‐processing coarse as‐built surfaces drives the need to control surface roughness during fabrication. Prior studies have evaluated the relationship between process parameters and as‐built surface roughness, but they rely on forward models using trial‐and‐error, regression, and data‐driven methods based only on areal surface roughness parameters that neglect spatial surface characteristics. In contrast, this study introduces, for the first time, an inverse data‐centric framework that leverages machine learning algorithms and an experimental dataset of Inconel 718 as‐built surfaces to predict the PBF‐LB process parameters required to achieve a desired as‐built roughness. This inverse model shows a prediction accuracy of ≈80%, compared to 90% for the corresponding forward model. Additionally, it incorporates deterministic surface roughness parameters, which capture both height and spatial information, and significantly improves prediction accuracy compared to only using areal parameters. The inverse model provides a digital tool to process engineers that enables control of surface roughness by tailoring process parameters. Hence, it establishes a foundation for integrating surface roughness control into the digital thread of AM, thereby reducing the need for post‐processing and improving process efficiency.more » « less
- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.3390/powders1040014
