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A strain-induced electrically conductive liquid metal emulsion for the programmable assembly of soft conductive composites is reported. This emulsion exhibits the shear yielding and shear thinning rheology required for direct ink writing. Examples of complex self-supported 3D printed structures with spanning features are presented to demonstrate the 3D printability of this emulsion. Stretchable liquid metal composites are fabricated by integrating this emulsion into a multi-material printing process with a 3D printable elastomer. The as-printed composites exhibit a low electrical conductivity but can be transformed into highly conductive composites by a single axial strain at low stresses ([Formula: see text] 0.3 MPa), an order of magnitude lower than other mechanical sintering approaches. The effects of axial strain and cyclic loading on the electrical conductivities of these composites are characterized. The electrical conductivity increases with activation strain, with a maximum observed relaxed conductivity of 8.61 × 105S⋅m−1, more than 300% higher than other mechanical sintering approaches. The electrical conductivity of these composites reaches a steady state for each strain after one cycle, remaining stable with low variation ([Formula: see text] standard deviation) over 1000 cycles. The strain sensitivities of these composites are quantitatively analyzed. All samples exhibit strain sensitivities that are lower than a bulk conductor throughout all strains. The printed composites showed low hysteresis at high strains, and high hysteresis at low strains, which may be influenced by the emulsion internal structure. The utility of these composites is shown by employing them as wiring into a single fabrication process for a stretchable array of LEDs.
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Stretchable and Self‐Healable Semiconductive Composites Based on Hydrogen Bonding Cross‐linked Elastomeric Matrix
Abstract Semiconductors with both high stretchability and self‐healing capability are highly desirable for various wearable devices. Much progress has been achieved in designing highly stretchable semiconductive polymers or composites. The demonstration of self‐healable semiconductive composite is still rare. Here, an extremely soft, highly stretchable, and self‐healable hydrogen bonding cross‐linked elastomer, amide functionalized‐polyisobutylene (PIB‐amide) is developed, to enable a self‐healable semiconductive composite through compounding with a high‐performance conjugated diketopyrrolopyrrole (DPP‐T) polymer. The composite, consisting of 20% DPP‐T and 80% PIB‐amide, shows record high crack‐onset strain (COS ≈1500%), extremely low elastic modulus (E≈1.6 MPa), and unique ability to spontaneously self‐heal atroom temperature within 5 min. Unlike previous works, these unique composite materials also show strain‐independent charge mobility. An in‐depth morphological study based on multi‐model techniques indicate that all composites show blending ratio‐ and stretching‐independent fibril‐like aggregation due to the strong hydrogen bond in elastomer to enable the unique stable charge mobility. This study provides a new direction to develop highly healable and electronically stable semiconductive composite and will enable new applications of stretchable electronics.
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- Award ID(s):
- 2047689
- PAR ID:
- 10424562
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Advanced Functional Materials
- Volume:
- 33
- Issue:
- 42
- ISSN:
- 1616-301X
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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