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This content will become publicly available on October 1, 2024

Title: Electrodeposited rhenium sandwich structures with thermal expansion mismatch and the superconducting transition behaviors
Award ID(s):
1941820 2016541
NSF-PAR ID:
10424837
Author(s) / Creator(s):
; ; ;
Date Published:
Journal Name:
Journal of Alloys and Compounds
Volume:
960
Issue:
C
ISSN:
0925-8388
Page Range / eLocation ID:
170808
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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