Kisitu, D., Caceres, C., Schaffarzick, D., and Ortega, A. Experimental Investigation of R134A Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling. Retrieved from https://par.nsf.gov/biblio/10435522. Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022 1.1 Web. doi:10.1115/IPACK2022-97400.

Kisitu, D., Caceres, C., Schaffarzick, D., & Ortega, A. Experimental Investigation of R134A Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling. Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022, 1 (1). Retrieved from https://par.nsf.gov/biblio/10435522. https://doi.org/10.1115/IPACK2022-97400

Kisitu, D., Caceres, C., Schaffarzick, D., and Ortega, A. "Experimental Investigation of R134A Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling". Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022 1 (1). Country unknown/Code not available. https://doi.org/10.1115/IPACK2022-97400. https://par.nsf.gov/biblio/10435522.

@article{osti_10435522,
place = {Country unknown/Code not available}, title = {Experimental Investigation of R134A Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling}, url = {https://par.nsf.gov/biblio/10435522}, DOI = {10.1115/IPACK2022-97400}, abstractNote = {}, journal = {Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022}, volume = {1}, number = {1}, author = {Kisitu, D. and Caceres, C. and Schaffarzick, D. and Ortega, A.}, }