An official website of the United States government
Conductive homoepitaxial Si-doped β-Ga2O3 films were fabricated by pulsed laser deposition with an as-deposited 2323 S cm−1 conductivity (resistivity = 4.3 × 10−4 Ω-cm, carrier concentration = 2.24 × 1020 cm−3, mobility = 64.5 cm2 V−1 s−1, and electrical activation efficiency = 77%). High quality homoepitaxial films deposited on commercial (010) Fe-compensated β-Ga2O substrates were determined by high-resolution transmission electron microscopy and x-ray diffraction. The β-Ga2O3 films have ∼70% transparency from 3.7 eV (335 nm) to 0.56 eV (2214 nm). The combination of high conductivity and transparency offers promise for numerous ultrawide bandgap electronics and optoelectronic applications.
more »
« less
Deposition of sputtered NiO as a p-type layer for heterojunction diodes with Ga2O3
The characteristics of sputtered NiO for use in pn heterojunctions with Ga2O3 were investigated as a function of sputtering parameters and postdeposition annealing temperature. The oxygen/ nickel and Ni2O3/NiO ratios, as well as the bandgap and resistivity, increased as a function of O2/Ar gas flow ratio. For example, the bandgap increased from 3.7 to 3.9 eV and the resistivity increased from 0.1 to 2.9 Ω cm for the O2/Ar ratio increasing from 1/30 to 1/3. By sharp contrast, the bandgap and Ni2O3/NiO ratio decreased monotonically with postdeposition annealing temperatures up to 600 °C, but the density of films increased due to a higher fraction of NiO being present. Hydrogen is readily incorporated into NiO during exposure to plasmas, as delineated by secondary ion mass spectrometry measurements on deuterated films. The band alignments of NiO films were type II-staggered gaps with both α- and β-Ga2O3. The breakdown voltage of NiO/β-Ga2O3 heterojunction rectifiers was also a strong function of the O2/Ar flow ratio during deposition, with values of 1350 V for 1/3 and 830 V for 1/30.
more »
« less
- Award ID(s):
- 1856662
- PAR ID:
- 10440210
- Publisher / Repository:
- American Vacuum Society
- Date Published:
- Journal Name:
- Journal of Vacuum Science & Technology A
- Volume:
- 41
- Issue:
- 1
- ISSN:
- 0734-2101
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
-
-
Si-doped β-phase (010) Ga2O3 epi-films with fast growth rates were comprehensively investigated using trimethylgallium (TMGa) as the Ga precursor via metalorganic chemical vapor deposition (MOCVD). Two main challenges facing the MOCVD growth of thick (010) β-Ga2O3 films with fast growth rates include high impurity carbon (C) incorporation and rough surface morphologies due to the formation of imbedded 3D pyramid-shaped structures. In this work, two different categories of oxygen source (high-purity O2 > 99.9999% and O2* with 10 ppm of [H2O]) were used for β-Ga2O3 MOCVD growth. Our study revealed that the size and density of the 3D defects in the β-Ga2O3 epi-films were significantly reduced when the O2* was used. In addition, the use of off-axis (010) Ga2O3 substrates with 2° off-cut angle leads to further reduction of defect formation in β-Ga2O3 with fast growth rates. To suppress C incorporation in MOCVD β-Ga2O3 grown with high TMGa flow rates, our findings indicate that high O2 (or O2*) flow rates are essential. Superior room temperature electron mobilities as high as 110–190 cm2/V·s were achieved for β-Ga2O3 grown using O2* (2000 sccm) with a growth rate of 4.5 μm/h (film thickness of 6.3 μm) within the doping range of 1.3 × 1018–7 × 1015 cm−3. The C incorporation is significantly suppressed from ∼1018 cm−3 to <5 × 1016 cm−3 ([C] detection limit) for β-Ga2O3 grown using high O2 (O2*) flow rate of 2000 sccm. Results from this work will provide guidance on developing high-quality, thick β-Ga2O3 films required for high power electronic devices with vertical configurations.more » « less
-
There is increasing interest in the alpha polytype of Ga2O3 because of its even larger bandgap than the more studied beta polytype, but in common with the latter, there is no viable p-type doping technology. One option is to use p-type oxides to realize heterojunctions and NiO is one of the candidate oxides. The band alignment of sputtered NiO on α-Ga2O3 remains type II, staggered gap for annealing temperatures up to 600 °C, showing that this is a viable approach for hole injection in power electronic devices based on the alpha polytype of Ga2O3. The magnitude of both the conduction and valence band offsets increases with temperature up to 500 °C, but then is stable to 600 °C. For the as-deposited NiO/α-Ga2O3 heterojunction, ΔEV = −2.8 and ΔEC = 1.6 eV, while after 600 °C annealing the corresponding values are ΔEV = −4.4 and ΔEC = 3.02 eV. These values are 1−2 eV larger than for the NiO/β-Ga2O3 heterojunction.more » « less
-
The temperature-dependent behavior of on/off ratio and reverse recovery time in vertical heterojunction p-NiO/β n-Ga2O/n+ Ga2O3 rectifiers was investigated over the temperature range of 25–300 °C. The device characteristics in forward bias showed evidence of multiple current transport mechanisms and were found to be dependent on the applied bias voltages and temperatures. The on–off ratio decreased from 3 × 106 at 25 °C to 2.5 × 104 at 300 °C for switching to 100 V reverse bias. For 200 μm diameter rectifiers, the reverse recovery time of ∼21 ns was independent of temperature, with the Irr monotonically increasing from 15.1 mA at 25 °C to 25.6 mA at 250 °C and dropping at 300 °C. The dI/dt increased from 4.2 to 4.6 A/μs over this temperature range. The turn-on voltage decreased from 2.9 V at 25 °C to 1.7 V at 300 °C. The temperature coefficient of breakdown voltage was negative and does not support the presence of avalanche breakdown in NiO/β-Ga2O3 rectifiers. The energy loss during switching from 100 V was in the range 23–31 μJ over the temperature range investigated.more » « less
-
In this work, we demonstrate the growth and phase stabilization of ultrawide bandgap polycrystalline rutile germanium dioxide (GeO2) thin films. GeO2 thin films were deposited using RF magnetron sputtering on r-plane sapphire (Al2O3) substrates. As-deposited films were x-ray amorphous. Postdeposition annealing was performed at temperatures between 650 and 950 °C in an oxygen or nitrogen ambient. Annealing at temperatures from 750 to 950 °C resulted in mixed-phase polycrystalline films containing tetragonal (rutile) GeO2, hexagonal (α-quartz) GeO2, and/or cubic (diamond) germanium (Ge). When nitrogen was used as the anneal ambient, mixed GeO2 phases were observed. In contrast, annealing in oxygen promoted stabilization of the r-GeO2 phase. Grazing angle x-ray diffraction showed a preferred orientation of (220) r-GeO2 for all crystallized films. The combination of O2 annealing and O2 flux during growth resulted in r-GeO2 films with highly preferential alignment. Using electron microscopy, we observed an interfacial layer of hexagonal-oriented GeO2 with epitaxial alignment to the (11¯02) Al2O3 substrate, which may help stabilize the top polycrystalline r-GeO2 film.more » « less
