Contactless Material Identification with Millimeter Wave Vibrometry
- Award ID(s):
- 1750725
- PAR ID:
- 10441657
- Date Published:
- Journal Name:
- The 21st International Conference on Mobile Systems, Applications, and Services (MobiSys ’23)
- Page Range / eLocation ID:
- 475 to 488
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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