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This content will become publicly available on June 18, 2024

Title: Contactless Material Identification with Millimeter Wave Vibrometry
Award ID(s):
1750725
NSF-PAR ID:
10441657
Author(s) / Creator(s):
; ; ; ; ;
Date Published:
Journal Name:
The 21st International Conference on Mobile Systems, Applications, and Services (MobiSys ’23)
Page Range / eLocation ID:
475 to 488
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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