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Abstract Thermal management in electric vehicles, electronics, and robotics requires the systematic ability to dissipate and direct the flow of heat. Thermally conductive soft composites are promising for thermal management due to their high thermal conductivity and mechanical flexibility. However, composites typically have the same microstructure throughout a film, which limits directional and spatial control of thermal management in emerging systems that have distributed heat loads. Herein, directional and spatially tunable thermal properties are programmed into liquid metal (LM) soft composites through a direct ink writing (DIW) process. Through the local control of LM droplet aspect ratio and orientation this programmable LM microstructure has a thermal conductivity in the direction of LM elongation of 9.9 W m−1·K−1, which is ∼40 times higher than the unfilled elastomer (0.24 W m−1·K−1). The DIW process enables LM droplets to be oriented in specific directions with tunable aspect ratios at different locations throughout a continuous film. This introduces anisotropic and heterogeneous thermal conductivity in compliant films to control the direction and magnitude of heat transfer. This methodology and resulting materials can provide designed thermal management solutions for rigid and soft devices.
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Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker
Abstract Gallium‐based liquid metal (LM) composite with metallic fillers is an emerging class of thermal interface materials (TIMs), which are widely applied in electronics and power systems to improve their performance. In situ alloying between gallium and many metallic fillers like copper and silver, however, leads to a deteriorated composite stability. This paper presents an interfacial engineering approach using 3‐chloropropyltriethoxysilane (CPTES) to serve as effective thermal linkers and diffusion barriers at the copper‐gallium oxide interfaces in the LM matrix, achieving an enhancement in both thermal conductivity and stability of the composite. By mixing LM with copper particles modified by CPTES, a thermal conductivity (κ) as high as 65.9 W m−1K−1is achieved. In addition, κ can be tuned by altering the terminal groups of silane molecules, demonstrating the flexibility of this approach. The potential use of such composite as a TIM is also shown in the heat dissipation of a computer central processing unit. While most studies on LM‐based composites enhance the material performance via direct mixing of various fillers, this work provides a different approach to fabricate high‐performance LM‐based composites and may further advance their applications in various areas including thermal management systems, flexible electronics, consumer electronics, and biomedical systems.
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- Award ID(s):
- 2032409
- PAR ID:
- 10446235
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Advanced Materials
- Volume:
- 33
- Issue:
- 43
- ISSN:
- 0935-9648
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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