An official website of the United States government
Abstract The realization of low thermal conductivity at high temperatures (0.11 W m−1K−1800 °C) in ambient air in a porous solid thermal insulation material, using stable packed nanoparticles of high‐entropy spinel oxide with 8 cations (HESO‐8 NPs) with a relatively high packing density of ≈50%, is reported. The high‐density HESO‐8 NP pellets possess around 1000‐fold lower thermal diffusivity than that of air, resulting in much slower heat propagation when subjected to a transient heat flux. The low thermal conductivity and diffusivity are realized by suppressing all three modes of heat transfer, namely solid conduction, gas conduction, and thermal radiation, via stable nanoconstriction and infrared‐absorbing nature of the HESO‐8 NPs, which are enabled by remarkable microstructural stability against coarsening at high temperatures due to the high entropy. This work can elucidate the design of the next‐generation high‐temperature thermal insulation materials using high‐entropy ceramic nanostructures.
more »
« less
Cryogenic characteristics of graphene composites—evolution from thermal conductors to thermal insulators
Abstract The development of cryogenic semiconductor electronics and superconducting quantum computing requires composite materials that can provide both thermal conduction and thermal insulation. We demonstrated that at cryogenic temperatures, the thermal conductivity of graphene composites can be both higher and lower than that of the reference pristine epoxy, depending on the graphene filler loading and temperature. There exists a well-defined cross-over temperature—above it, the thermal conductivity of composites increases with the addition of graphene; below it, the thermal conductivity decreases with the addition of graphene. The counter-intuitive trend was explained by the specificity of heat conduction at low temperatures: graphene fillers can serve as, both, the scattering centers for phonons in the matrix material and as the conduits of heat. We offer a physical model that explains the experimental trends by the increasing effect of the thermal boundary resistance at cryogenic temperatures and the anomalous thermal percolation threshold, which becomes temperature dependent. The obtained results suggest the possibility of using graphene composites for, both, removing the heat and thermally insulating components at cryogenic temperatures—a capability important for quantum computing and cryogenically cooled conventional electronics.
more »
« less
- Award ID(s):
- 2019056
- PAR ID:
- 10418419
- Publisher / Repository:
- Nature Publishing Group
- Date Published:
- Journal Name:
- Nature Communications
- Volume:
- 14
- Issue:
- 1
- ISSN:
- 2041-1723
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
-
-
Abstract Gallium‐based liquid metal (LM) composite with metallic fillers is an emerging class of thermal interface materials (TIMs), which are widely applied in electronics and power systems to improve their performance. In situ alloying between gallium and many metallic fillers like copper and silver, however, leads to a deteriorated composite stability. This paper presents an interfacial engineering approach using 3‐chloropropyltriethoxysilane (CPTES) to serve as effective thermal linkers and diffusion barriers at the copper‐gallium oxide interfaces in the LM matrix, achieving an enhancement in both thermal conductivity and stability of the composite. By mixing LM with copper particles modified by CPTES, a thermal conductivity (κ) as high as 65.9 W m−1K−1is achieved. In addition, κ can be tuned by altering the terminal groups of silane molecules, demonstrating the flexibility of this approach. The potential use of such composite as a TIM is also shown in the heat dissipation of a computer central processing unit. While most studies on LM‐based composites enhance the material performance via direct mixing of various fillers, this work provides a different approach to fabricate high‐performance LM‐based composites and may further advance their applications in various areas including thermal management systems, flexible electronics, consumer electronics, and biomedical systems.more » « less
-
Abstract Heat transport in nanoscale carbon materials such as carbon nanotubes and graphene is normally dominated by phonons. Here, measurements of in‐plane thermal conductivity, electrical conductivity, and thermopower are presented from 77–350 K on two films with thickness <100 nm formed from semiconducting single‐walled carbon nanotubes. These measurements are made with silicon–nitride membrane thermal isolation platforms. The two films, formed from disordered networks of tubes with differing tube and bundle size, have very different thermal conductivity. One film matches a simple model of heat conduction assuming constant phonon velocity and mean free path, and 3D Debye heat capacity with a Debye temperature of 770 K. The second film shows a more complicated temperature dependence, with a dramatic drop in a relatively narrow window near 200 K where phonon contributions to thermal conductivity essentially vanish. This causes a corresponding large increase in thermoelectric figure‐of‐merit at the same temperature. A better understanding of this behavior can allow significant improvement in thermoelectric efficiency of these low‐cost earth‐abundant, organic electronic materials. Heat and charge conductivity near room temperature is also presented as a function of doping, which provides further information on the interaction of dopant molecules and phonon transport in disordered nanotube films.more » « less
-
Abstract Liquid‐metal embedded elastomers (LMEEs) have been demonstrated to show a variety of excellent properties, including high toughness, dielectric constant, and thermal conductivity, with applications across soft electronics and robotics. However, within this scope of use cases, operation in extreme environments – such as high‐temperature conditions – may lead to material degradation. While prior works highlight the functionality of LMEEs, there is limited insight on the thermal stability of these soft materials and how the effects of liquid metal (LM) inclusions depend on temperature. Here, the effects on thermal stability, including mechanical and electrical properties, of LMEEs are introduced. Effects are characterized for both fluoroelastomer and other elastomer‐based composites at temperature exposures up to 325 °C, where it is shown that embedding LM can offer improvements in thermo‐mechanical stability. Compared to elastomer like silicone rubber that has been previously used for LMEEs, a fluoroelastomer matrix offers a higher dielectric constant and significant improvement in thermo‐mechanical stability without sacrificing room temperature properties, such as thermal conductivity and modulus. Fluoroelastomer‐LM composites offer a promising soft, multi‐functional material for high‐temperature applications, which is demonstrated here with a printed, soft heat sink and an endoscopic sensor capable of wireless sensing of high temperatures.more » « less
-
Thermal interface material (TIM) that exists in a liquid state at the service temperature enables efficient heat transfer across two adjacent surfaces in electronic applications. In this work, the thermal conductivities of different phase regions in the Ga-In system at various compositions and temperatures are measured for the first time. A modified comparative cut bar technique is used for the measurement of the thermal conductivities of GaxIn1−x (x = 0, 0.1, 0.214, 0.3, and 0.9) alloys at 40, 60, 80, and 100 °C, the temperatures commonly encountered in consumer electronics. The thermal conductivity of liquid and semi-liquid (liquid + β) Ga-In alloys are higher than most of the TIM’s currently used in consumer electronics. These measured quantities, along with the available experimental data from literature, served as input for the thermal conductivity parameter optimization using the CALPHAD (calculation of phase diagrams) method for pure elements, solution phase, and two-phase region. A set of self-consistent parameters for the description of the thermal conductivity of the Ga-In system is obtained. There is good agreement between the measured and calculated thermal conductivities for all of the phases. Due to their ease of manufacturing and high thermal conductivity, liquid/semi-liquid Ga-In alloys have significant potential for TIM in consumer electronics.more » « less
