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Title: Electromechanical deformation and failure of multilayered films
Abstract

Layer thickness was found to have a significant effect on the irreversible electromechanical deformation and the failure mechanism in polycarbonate (PC)/poly (vinylidene fluoride) (PVDF) multilayered films when subjected to an electrical impulse in a DC needle‐plane configuration. Three distinct regions of behavior were observed. Region I comprised thick layer systems that exhibited only irreversible center deformation. The improvement to failure resistance compared to the monolithic films was attributed to the interphase between the two components. Region II films with an intermediate layer thickness showed both an irreversible center deformation and a treeing mechanism which were observed to simultaneously occur. The surface treeing mechanism, similar to the lightning treeing phenomena in nature, occurs only at impact rates. The tree morphology showed large amounts of plowing, indicating that this damage mechanism can dissipate a large amount of energy prior to electromechanical fracture of the film. Region III films comprise ultrathin layers in the nanoscale and showed no treeing. The unique interphase region between these ultrathin layers was estimated to be at least ten percent of the overall layered structure. These films behaved similar to monolithic materials with improved electromechanical failure characteristics. This work complements the enhanced dielectric performance of multilayer films observed in earlier investigations.

 
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NSF-PAR ID:
10454599
Author(s) / Creator(s):
 ;  ;  ;  
Publisher / Repository:
Wiley Blackwell (John Wiley & Sons)
Date Published:
Journal Name:
Journal of Applied Polymer Science
Volume:
138
Issue:
17
ISSN:
0021-8995
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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    Acknowledgment

    This work was partially supported by the U.S. National Science Foundation (NSF) Award No. ECCS-1931088. S.L. and H.W.S. acknowledge the support from the Improvement of Measurement Standards and Technology for Mechanical Metrology (Grant No. 22011044) by KRISS.

    Figure 1

     

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