Lead zirconate titanate (PZT) thin films offer advantages in microelectromechanical systems (MEMSs) including large motion, lower drive voltage, and high energy densities. Depending on the application, different substrates are sometimes required. Self-heating occurs in the PZT MEMS due to the energy loss from domain wall motion, which can degrade the device performance and reliability. In this work, the self-heating of PZT thin films on Si and glass and a film released from a substrate were investigated to understand the effect of substrates on the device temperature rise. Nano-particle assisted Raman thermometry was employed to quantify the operational temperature rise of these PZT actuators. The results were validated using a finite element thermal model, where the volumetric heat generation was experimentally determined from the hysteresis loss. While the volumetric heat generation of the PZT films on different substrates was similar, the PZT films on the Si substrate showed a minimal temperature rise due to the effective heat dissipation through the high thermal conductivity substrate. The temperature rise on the released structure is 6.8× higher than that on the glass substrates due to the absence of vertical heat dissipation. The experimental and modeling results show that the thin layer of residual Si remaining after etching plays a crucial role in mitigating the effect of device self-heating. The outcomes of this study suggest that high thermal conductivity passive elastic layers can be used as an effective thermal management solution for PZT-based MEMS actuators. 
                        more » 
                        « less   
                    
                            
                            Interface Stress for Bidirectional Frequency Tuning of Prebuckled Vanadium Dioxide MEMS Resonators
                        
                    
    
            Abstract Interface stress between structural materials and thin film coatings has a significant influence on the resonant frequency of microelectromechanical system (MEMS) resonators. In this work, the axial stress on different types of buckled bridge MEMS resonator structures is controlled through the solid‐to‐solid phase transition of a VO2thin film coating. The devices have identical dimensions, but different buckling orientations and profiles due to the combined effect of overetching and residual thermal stress mismatch. Thermal actuation is used to tune the resonant frequency of the device, but the changes in frequency are found to be dependent on the type of buckling for the device. Thermal actuation is achieved by applying an electrical current to integrated heaters, or by uniform substrate heating. Bidirectional tunability is found when substrate heating is used, while Joule heating shows a monotonic change in frequency. This phenomenon can be attributed to the transition in boundary conditions, where the turning points are indicated by the prominent changes in buckling amplitude. In addition, devices with opposite buckling orientations exhibit different tuning behaviors which can be explained by different bending moments induced by beam stress interface modification. 
        more » 
        « less   
        
    
                            - Award ID(s):
- 1854750
- PAR ID:
- 10459519
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Advanced Materials Interfaces
- Volume:
- 6
- Issue:
- 21
- ISSN:
- 2196-7350
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
- 
            
- 
            This paper presents a novel approach employing localized annealing through Joule heating to enhance the performance of Thin-Film Piezoelectric-on-Silicon (TPoS) MEMS resonators that are crucial for applications in sensing, energy harvesting, frequency filtering, and timing control. Despite recent advancements, piezoelectric MEMS resonators still suffer from anchor-related energy losses and limited quality factors (Qs), posing significant challenges for high-performance applications. This study investigates interface modification to boost the quality factor (Q) and reduce the motional resistance, thus improving the electromechanical coupling coefficient and reducing insertion loss. To balance the trade-off between device miniaturization and performance, this work uniquely applies DC current-induced localized annealing to TPoS MEMS resonators, facilitating metal diffusion at the interface. This process results in the formation of platinum silicide, modifying the resonator’s stiffness and density, consequently enhancing the acoustic velocity and mitigating the side-supporting anchor-related energy dissipations. Experimental results demonstrate a Q-factor enhancement of over 300% (from 916 to 3632) and a reduction in insertion loss by more than 14 dB, underscoring the efficacy of this method for reducing anchor-related dissipations due to the highest annealing temperature at the anchors. The findings not only confirm the feasibility of Joule heating for interface modifications in MEMS resonators but also set a foundation for advancements of this post-fabrication thermal treatment technology.more » « less
- 
            Microelectromechanical sensors (MEMS) offer a new way of measuring temperature and infrared (IR) radiation, through measurements of total optical energy, overcoming the obstacles associated with narrow bandgap semiconductor detectors[1]. Specifically, Thin Film Bulk Acoustic Resonators (FBAR) offers a versatile MEMS technology based on resonant devices fabricated using piezoelectric materials [2]. With the addition of an absorbing susceptor and the use of zinc oxide (ZnO) as the piezoelectric it is possible to obtain a higher sensitivity device than previously demonstrated systems, taking advantage of ZnO's higher temperature coefficient of frequency (TCF) [3,4,5]. This work studies the improved sensing ability of an FBAR structure and ease of testing and superior parasitic performance provided in a package using an engineered high TCF FBAR in a monolithically integrated CMOS process.more » « less
- 
            Spin crossover complexes are a route toward designing molecular devices with a facile readout due to the change in conductance that accompanies the change in spin state. Because substrate effects are important for any molecular device, there are increased efforts to characterize the influence of the substrate on the spin state transition. Several classes of spin crossover molecules deposited on different types of surface, including metallic and non-metallic substrates, are comprehensively reviewed here. While some non-metallic substrates like graphite seem to be promising from experimental measurements, theoretical and experimental studies indicate that 2D semiconductor surfaces will have minimum interaction with spin crossover molecules. Most metallic substrates, such as Au and Cu, tend to suppress changes in spin state and affect the spin state switching process due to the interaction at the molecule–substrate interface that lock spin crossover molecules in a particular spin state or mixed spin state. Of course, the influence of the substrate on a spin crossover thin film depends on the molecular film thickness and perhaps the method used to deposit the molecular film.more » « less
- 
            Abstract Printing functional devices on flexible substrates requires printing of high conductivity metallic patterns. To prevent deformation and damage of the polymeric substrate, the processing (printing) and post-processing (annealing) temperature of the metal patterns must be lower than the glass transition temperature of the substrate. Here, a hybrid process including deposition of a sacrificial blanket thin film, followed by room environment nozzle-based electrodeposition, and subsequent etching of the blanket film is demonstrated to print pure and nanocrystalline metallic (Ni and Cu) patterns on flexible substrates (PI and PET). Microscopy and spectroscopy showed that the printed metal is nanocrystalline, solid with no porosity and with low impurities. Electrical resistivity close to the bulk (~2-time) was obtained without any thermal annealing. Mechanical characterization confirmed excellent cyclic strength of the deposited metal, with limited degradation under high cyclic flexure. Several devices including radio frequency identification (RFID) tag, heater, strain gauge, and temperature sensor are demonstrated.more » « less
 An official website of the United States government
An official website of the United States government 
				
			 
					 
					
