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Title: High-Speed Differential Via Optimization using a High-Accuracy and High-Bandwidth Via Model
Award ID(s):
1916535
PAR ID:
10465820
Author(s) / Creator(s):
; ; ; ; ; ;
Date Published:
Journal Name:
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
Page Range / eLocation ID:
280 to 285
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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