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This content will become publicly available on July 29, 2024

Title: Modeling of a Microstrip Line Referenced to a Meshed Return Plane
Award ID(s):
1916535
NSF-PAR ID:
10465830
Author(s) / Creator(s):
; ; ; ; ; ;
Date Published:
Journal Name:
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
Page Range / eLocation ID:
291 to 295
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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