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Title: Coupling Path Analysis for Smart Speaker Intentional Electromagnetic Interference Attacks
Award ID(s):
1916535
PAR ID:
10465883
Author(s) / Creator(s):
; ; ;
Date Published:
Journal Name:
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
Page Range / eLocation ID:
488 to 494
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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