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Title: Machine Learning Based PCB/Package Stack-up Optimization for Signal Integrity
Award ID(s):
1916535
PAR ID:
10465884
Author(s) / Creator(s):
; ; ; ; ;
Date Published:
Journal Name:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
Page Range / eLocation ID:
1885 to 1891
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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